5.0 mm
INFRARED
EMITTING
DIODE
REV:A / 1
L515EIR1C
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid stressing the leads (See Fig.3).
P C b o a r d
（F ）
ig.3
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable: select a
best-suited method that assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
STORAGE
1) The LEDs should be stored at 30℃ or less and 70% RH or less after being shipped from PARA
and the storage life limit is 1 year .
2) PARA LED lead frames are comprised of a tin plated iron alloy. The surface may be affected by
environments which contain corrosive gases and so on. Please avoid conditions which may
cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause
difficulty during soldering operations. It is recommended that the LEDs be used as soon as
possible.
3）Please avoid rapid changes in ambient temperature, especially, in high humidity environments
where condensation can occur.
DRAWING NO. : DS-23-09-0069
DATE : 2009-08-10
Page : 7
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
