Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
Wave soldering:
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed
consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering:
、
℃
1 Pre-Heat Temp:150-180 ,120sec.Max.
、
℃
2 Soldering Temp: Temperature Of Soldering Pot Over 230 ,40sec.Max.
、
℃，
3 Peak Temperature:260
5sec.
、
4 Reflow Repetition:2 Times Max.
、
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended):
、
℃
1 Iron Tip Temp:350 Max.
、
2 Soldering Iron:30w Max.
、
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering:
、
℃
1 Pre-Heat Temp:150
Max. 120 Sec. Max.
、
℃
2 Bath Temp:265 Max.
、
3 Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO.: DS-31-09-XXXX
DATE: 2009-06-30
PAGE 12of 13
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PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
