3.0 mm
SOLDERING
METHOD
PHOTOTRANSISTOR
L-32ROPT1C
REV:A / 2
SOLDERING CONDITIONS
REMARK
Solder no closer than 3mm from the
DIP
SOLDERING
Bath temperature: 260℃
Immersion time: with 5 sec, 1 time
base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
Attached data of temperatuare cure
for your reference
During soldering, take care not to
press the tip of iron against the
Soldering iron: 30W or smaller
lead.
SOLDERING
Temperature at tip of iron: 260
℃
or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
L e a d w r i e s
P a n e l
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
L e a v e
a s l i g h t
c l e a r a n c e
L e a d
w r i e s
(Fig.2)
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and sliver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3
seconds.
DRAWING NO. : DS-21-03-0009
DATE : 2005-12-19
Page : 6
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
