3.0 mm PHOTOTRANSISTOR
L-32ROPT1C
REV:A / 2
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK！
1Kg
Fig.10
y HEAT GENERATION
1) Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when making the system design. The coefficient of temperature increase
per input electric power is affected by the thermal resistance of the circuit board and density of
LED placement on the board, as well as other components. It is necessary to avoid intense
heat generation and operate within the maximum ratings given in this specification.
The operating current should be decided after considering the ambient maximum temperature of
LEDs.
yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
Freon TE
Chlorothene
Isopropyl Alcohol
Thinner
ADAPTABILITY
NOTE: Influences of ultrasonic cleaning of the LED
resin body differ depending on such factors
as the oscillator output, size of the PC board
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed after confirming there is no problem by
conducting a test under practical.
⊙
╳
⊙
╳
╳
╳
Acetone
Trichloroethylene
⊙--Usable
╳--Do not use.
DRAWING NO. : DS-21-03-0009
DATE : 2005-12-19
Page :10
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
