Chip Bead Cores
■
Recommended Land Pattern Dimensions in mm (not to scale)
(mm)
Part Number
EXCCL4532U1
EXCCL3225U1
A
B
A
3
1.7
1.7
2.6 to 3
1.6 to 2
0.8 to 1.2
0.6 to 1
0.8 to 1
B
5.4
4.1
4.1
5.5 to 6.5
4 to 5
3 to 4
2 to 3
2 to 2.6
C
2.8
2.1
1.2
1.2 to 1.6
1.2 to 1.6
1 to 1.2
0.8 to 1
0.8 to 1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
H
C
■
Recommended Soldering Conditions
Recommendations and precautions are described below.
●
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
Temperature
Preheating
Heating
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
<Repair with hand soldering>
●
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
●
Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. Flow soldering may cause this product to come off because the adhesiveness of the product element is low.
Please consult our sales representative in advance about flow soldering.
2. Use rosin-based flux or halogen-free flux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance.
Excessive mechanical stress may damage the bead cores. Handle with care.
5. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of
40 % to 60 %, where there are no rapid changes in temperature or humidity.
6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection
indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jul. 2008
PANASONIC [ PANASONIC SEMICONDUCTOR ]
