Chip Bead Cores
■
Packaging Methods (Taping)
●
Standard Quantity
Part Number
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
H
●
Taping Reel
T
t
1
Kind of Taping
Pitch (P
1
)
8 mm
Quantity
1000 pcs./reel
2000 pcs./reel
Embossed Carrier Taping
4 mm
3000 pcs./reel
4000 pcs./reel
●
Embossed Carrier Taping
Sprocket hole
φD
0
A
B
Compartment
φ
C
E
F
W
φ
D
t
2
Chip component
P
1
P
2
P
0
E
Tape running direction
φ
A
W
Embossed Carrier Dimensions (mm)
Part Number
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
H
A
B
W
F
E
P
1
8.0±0.1
P
2
P
0
φD
0
t
1
t
2
2.4 max.
2.1 max.
3.6±0.2 4.9±0.2 12.0±0.2 5.5±0.1
2.9±0.2 3.6±0.2
2.0±0.2 3.6±0.2
1.9±0.2 3.5±0.2
1.5±0.2 2.3±0.2
1.1±0.2 2.1±0.2
1.0±0.1 1.8±0.1
8.0±0.2 3.5±0.1
8.0±0.2 3.5±0.1
1.9±0.2 4.8±0.2 12.0±0.2 5.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 0.20±0.05 1.8 max.
1.6 max.
0.25±0.05
Standard Reel Dimensions (mm)
Part Number
EXCCL4532U1
EXCCL3225U1
EXCCL3216U1
EXCML45A910H
EXCML32A680U
EXCML20A390U
EXCML16A270U
EXC3B
H
09.5
+0.5
–1.0
13 max.
0
180.0
–3.0
φA
φB
φC
φD
E
W
13.0
+0.5
–1.0
09.5
+0.5
–1.0
T
16.5 max.
13 max.
16.5 max.
60.0±1.0
13.0±0.5
21.0±0.8
2.0±0.5
–1.0
13.0
+0.5
1.2±0.5
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
φ
B
t
t
PANASONIC [ PANASONIC SEMICONDUCTOR ]
