Chip Resistor Networks
Chip Resistor Networks
Type:
EXBD:1206
EXBE:1608
EXBA:2512
EXBQ:1506
■
Features
●
High density placing for digital signal circuits
· Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm
×
1.6 mm
×
0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm
×
2.1 mm
×
0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm
×
3.1 mm
×
0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm
×
1.6 mm
×
0.45 mm, 0.5 mm pitch
· Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(“High density placing” is shown below)
●
High speed mounting using conventional placing machine
●
Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
●
RoHS compliant
<High density placing>
Pull up resistors
V
CC
EXBE10C
V
CC
Direct placement on the bus line
EXBA10P
V
CC
IC
IC
No through hole
IC
IC
IC
IC
Through holes
0.4 mm pitch
0.635 mm pitch
■
Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions
Please see Data Files
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
Product Code
Thick Film
Resistor
Network
Dimension Code of
Chip Resistor Network
Type: inches
D : 1206
E : 1608
A : 2512
Q : 1506
Dimensions
3.2 mm 1.6 mm
4.0 mm 2.1 mm
6.4 mm 3.1 mm
3.8 mm 1.6 mm
Number of
Terminals
10(EXBD,E,A)
16(EXBQ)
Circuit Configuration
Code
C
P
Common Terminal Position
Center common circuit
(EXBD, EXBE)
Diagonal common circuit
(Terminal 5 and Terminal 10)
(EXBA)
One side common circuit
(Terminal 16)
(EXBQ)
Diagonal common circuit
(Terminal 1 and Terminal 6)
(EXBA)
Resistance Value
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Resistance
Tolerance
±5 %
J
Suffix for Special
Requirements
P
E
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Aug. 2012
36
PANASONIC [ PANASONIC SEMICONDUCTOR ]
