PAM2303
3A Low Noise Step-Down DC-DC Converter
Pin Configuration & Marking Information
Top View
DFN3X3-10
SW
SW
SW
GND
EN
1
2
3
4
5
10
9
VIN
VIN
VIN
NC
FB
P2303C
XXXYW
8
7
6
C:
Y:
W:
X:
Pin Configuration
Year
Week
Internal Code
GND
(Exposed Pad)
Pin Description
Name
SW
GND
EN
FB
NC
VIN
DFN3X3-10
1,2,3
4
5
6
7
8,9,10
GND
Enable control input. Force this pin voltage above 1.5V, enables the chip, and
below 0.3V shuts down the device.
Feedback voltage to internal error amplifier, the threshold voltage is 0.6V.
No connec ted
Bias supply. Chip main power supply pin
Function
The drains of the internal main and synchronous power MOSFET.
Absolute Maximum Ratings
These are stress ratings only and functional operation is not implied. Exposure to absolute maximum
ratings for prolonged time periods may affect device reliability. All voltages are with respect to ground.
Input Voltage PV
IN
,V
IN
......................................6V
SW Pin Voltage......................-0.3V to (PV
IN
+0.3V)
FB Pin Voltage.........................-0.3V to (V
IN
+0.3V)
EN Pin Voltage...................................- 0.3V to -6V
Maximum Junction Temperature..................150°
C
Storage Temperature Range...........-65° to 150°
C
C
Soldering Temperature.......................300° 5sec
C,
Recommended Operating Conditions
Supply Voltage..................................2.7V to 5.5V
Junction Temperature Range..........-40 ° to 125 °
C
C
Ambient Temperature Range...........-40 ° to 85 °
C
C
Thermal Information
Parameter
Thermal Resistanc e (Junction to Ambient)
Symbol
θ
JA
Package
SOP-8(EP)
DFN3X3-10
QFN3X3-16
SOP-8(EP)
Thermal Resistance (Junction to Case)
θ
JC
DFN3X3-10
QFN3X3-16
Maximum
90
60
35
11
8.5
11
°
C/W
°
C/W
Unit
Power Analog Microelectronics
,
Inc
www.poweranalog.com
11/2011 Rev1.2
3
PAM [ POWER ANALOG MICOELECTRONICS ]
