OXU140CM Data Sheet
Oxford Semiconductor, Inc.
Table 4 DC Characteristics, High-Speed USB I/O Signals: DP
P
and
DM
P
Only
Symbol
V
HSDIFF
V
HSCM
V
HSSQ
V
HSIO
V
HSOL
V
HSOH
V
CHIRPK
Parameter
High-speed differential input
sensitivity
High-speed data signaling
common mode range
High-speed squelch detection
threshold
High-speed idle output voltage
(differential)
High-speed low-level output
voltage (differential)
High-speed high-level output
voltage (differential)
Chirp-K output voltage
(differential)
Squelch detected
No squelch detected
150
-10
-10
-360
-900
10
10
400
-500
Condition
|V
I(DP
P
) -- VI(DM
P
)|
Min
300
-50
500
100
Max
Unit
mV
mV
mV
mV
mV
mV
mV
mV
Table 5 DC Characteristics, Logic Signals
Symbol
V
OL
V
OH
V
IL
V
IH
C
IN
C
OUT
C
BI
I
IN
Note:
Parameter
Low-level output voltage
High-level output voltage
Low-level input voltage
High-level input voltage
Input capacitance
Output capacitance
Bi-directional capacitance
Input leakage current
V
DDW
= 3.3 V
V
DDW
= 1.8 V
V
DDW
= 3.3 V
V
DDW
= 1.8 V
V
DDW
= 3.3 V
V
DDW
= 1.8 V
Condition
Min
2.4
0.75*V
DDW
Max
0.4
Unit
V
V
V
0.8
0.3*V
DDW
2.0
0.7*V
DDW
2.2 (typical)
2.2 (typical)
2.2 (typical)
V
V
V
V
pF
pF
pF
µA
No pull up or pull down
-10
10
The capacitances listed above do not include pad capacitance and package capacitance.
One can estimate pin capacitance by adding pad capacitance of about 0.5 pF; and the
package capacitance, which is about 0.86 pF max for QFP and 0.42 pF max for BGA.
Table 6 DC Characteristics, ID Resistance
Symbol
R
B-PLUG-ID
R
A-PLUG-ID
Parameter
Resistance to ground on mini-B plug
Resistance to ground on mini-A plug
Condition
Min
100 K
10
Max
Unit
Ω
Ω
6
External--Free Release
DS-0038 Jul 06
OXFORD [ OXFORD SEMICONDUCTOR ]
