Oxford Semiconductor, Inc.
OXU140CM Data Sheet
Figure 3 shows the chip layout of the 100‐ball BGA package.
Figure 3 OXU140CM 100-Ball BGA Package (Top View)
VSSA
VSSA
VSSA
/CPE1P8V_EN
ENVREG
VDD3.3A
VBUS
ID
/OC
/PO
/CPE3P3V_EN
DP1
OSC2
10
9
/EXVBO
DP
2
CLKCFG
XMODE
/CEMOT_EN
VDD3.3A
DM
2
DPP
VDD3.3A
VOUT
EXT
VREGOUT
GPIO
VDD3.3A
VBP
DM 1
VDD1.8
A14
VDD3.3A
OSC 1
RREF
/CS
DM P
VSSA
A12
8
7
6
5
4
3
2
1
A5
VDD3.3
VDD1.8
VSSA
/RESET
DRQ 1
GPXB
D3
PD_PMOS
VSS
VDD3.3
TEST
NC (GP12)
A13
A11
A7
VSS
VDDW
/INT
GPX
A
VSS
DRQ
0
A10
VDDW
VDDCE
A9
A6
D12
ACK0
D1
VDD1.8
A8
ACK
D0
1
CEDAT2
A1
D13
D10
/WR
A2
CEDAT0
CEDAT7
CEDAT1
CEDAT6
CEDAT4
A4
D5
D2
D8
D11
D14
CECLK
D7
D4
15
D6
D9
D
/RD
A3
CECMD
CEDAT3
CEDAT5
A
B
C
D
E
F
G
H
J
K
DS-0038 Jul 06
External--Free Release
13
OXFORD [ OXFORD SEMICONDUCTOR ]
