SS22, SS24
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE E
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIM
A
A1
b
c
D
E
H
E
L
L1
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
2.03
2.11
0.23
0.30
3.56
3.81
4.32
4.57
5.44
5.59
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.095
0.006
0.083
0.012
0.150
0.180
0.220
0.050
b
D
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
ONSEMI [ ON SEMICONDUCTOR ]
