SS22, SS24
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
These devices employ the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
http://onsemi.com
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Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Over−Voltage Protection
Low Forward Voltage Drop
Pb−Free Package is Available
SCHOTTKY BARRIER
RECTIFIER
2 AMPERES
20, 40 VOLTS
Mechanical Characteristics
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 95 mg (approximately)
Cathode Polarity Band
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
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Available in 12 mm Tape, 2500 Units per 13 in Reel, Add “T3”
Suffix to Part Number
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Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
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ESD Ratings: Machine Model = C
ESD Ratings:
Human Body Model = 3B
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
SS2xG
G
SS2x
= Specific Device Code
x
= 2 or 4
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
SS22T3
SS24T3
SS24T3G
Package
SMB
SMB
SMB
(Pb−Free)
Shipping
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2500/Tape & Reel
2500/Tape & Reel
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2005
1
July, 2005 − Rev. 2
Publication Order Number:
SS24/D
ONSEMI [ ON SEMICONDUCTOR ]
