MMBV3401LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236AB)
CASE 318−08
ISSUE AN
D
SEE VIEW C
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318−01 THRU
−07
AND
−09
OBSOLETE, NEW STANDARD
318−08.
MILLIMETERS
INCHES
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
0.89
1.00
1.11
0.035
0.040
0.044
A1
0.01
0.06
0.10
0.001
0.002
0.004
b
0.37
0.44
0.50
0.015
0.018
0.020
c
0.09
0.13
0.18
0.003
0.005
0.007
D
2.80
2.90
3.04
0.110
0.114
0.120
E
1.20
1.30
1.40
0.047
0.051
0.055
e
1.78
1.90
2.04
0.070
0.075
0.081
L
0.10
0.20
0.30
0.004
0.008
0.012
0.35
0.54
0.69
0.014
0.021
0.029
L1
H
E
2.10
2.40
2.64
0.083
0.094
0.104
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
E
1
2
HE
c
e
b
q
0.25
A
A1
L
L1
VIEW C
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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3
MMBV3401LT1/D
ONSEMI [ ON SEMICONDUCTOR ]
