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MMBT5550LT1G 参数 Datasheet PDF下载

MMBT5550LT1G图片预览
型号: MMBT5550LT1G
PDF下载: 下载PDF文件 查看货源
内容描述: 高压晶体管NPN硅 [High Voltage Transistors NPN Silicon]
分类和应用: 晶体小信号双极晶体管开关光电二极管高压
文件页数/大小: 6 页 / 118 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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MMBT5550LT1G,
MMBT5551LT1G
High Voltage Transistors
NPN Silicon
Features
http://onsemi.com
COLLECTOR
3
1
BASE
2
EMITTER
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
MMBT5550
MMBT5551
MMBT5550
MMBT5551
Symbol
V
CEO
Value
140
160
160
180
6.0
600
> 8000
> 400
Unit
Vdc
Collector
−Base
Voltage
V
CBO
Vdc
1
2
3
MARKING
DIAGRAM
Emitter
−Base
Voltage
Collector Current
Continuous
Electrostatic Discharge
Human Body Model
Machine Model
V
EBO
I
C
ESD
Vdc
mAdc
V
SOT−23 (TO−236)
CASE 318
STYLE 6
x1x M
G
G
1
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR− 5 Board
(Note 1) @T
A
= 25°C
Derate Above 25°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
Substrate (Note 2) @T
A
= 25°C
Derate Above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
Symbol
P
D
Max
225
1.8
556
300
2.4
417
−55
to +150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
R
qJA
P
D
x1x = Device Code
M1F = MMBT5550LT
G1 = MMBT5551LT
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
R
qJA
T
J
, T
stg
ORDERING INFORMATION
Device
MMBT5550LT1G
MMBT5551LT1G
MMBT5551LT3G
Package
Shipping
SOT−23 3,000 / Tape & Reel
(Pb−Free)
SOT−23 3,000 / Tape & Reel
(Pb−Free)
SOT−23 10,000/Tape & Reel
(Pb−Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0

0.75

0.062 in.
2. Alumina = 0.4

0.3

0.024 in. 99.5% alumina.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2010
September, 2010
Rev. 9
1
Publication Order Number:
MMBT5550LT1/D