MC33269, NCV33269
DPAK
DT SUFFIX
CASE 369A−13
ISSUE AB
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
PLANE
−T−
2. CONTROLLING DIMENSION: INCH.
C
B
R
INCHES
DIM MIN MAX
MILLIMETERS
E
V
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
0.235
0.250
0.086
0.027
0.033
0.037
0.250
0.265
0.094
0.035
0.040
0.047
4
2
Z
A
K
S
1
3
G
H
J
0.180 BSC
4.58 BSC
U
0.034
0.018
0.102
0.040
0.023
0.114
0.87
0.46
2.60
1.01
0.58
2.89
K
L
0.090 BSC
2.29 BSC
F
J
R
S
U
V
Z
0.175
0.020
0.020
0.030
0.138
0.215
0.050
−−−
0.050
−−−
4.45
0.51
0.51
0.77
3.51
5.46
1.27
−−−
1.27
−−−
L
H
D 2 PL
M
G
0.13 (0.005)
T
SOLDERING FOOTPRINT*
6.20
3.0
0.244
0.118
2.58
0.101
5.80
0.228
1.6
0.063
6.172
0.243
mm
inches
ǒ
Ǔ
SCALE 3:1
Figure 17. DPAK
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
ONSEMI [ ONSEMI ]
