MC33201, MC33202, MC33204, NCV33202, NCV33204
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE F
−A−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
−B−
K
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
PIN 1 ID
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
G
D 8 PL
MILLIMETERS
INCHES
M
S
S
0.08 (0.003)
T
B
A
DIM MIN
MAX
3.10
3.10
1.10
MIN
MAX
0.122
0.122
0.043
0.016
A
B
C
D
G
H
J
2.90
2.90
−−−
0.25
0.65 BSC
0.05
0.13
4.75
0.40
0.114
0.114
−−−
0.40 0.010
SEATING
PLANE
0.026 BSC
−T−
0.15 0.002
0.23 0.005
5.05 0.187
0.70 0.016
0.006
0.009
0.199
0.028
C
0.038 (0.0015)
K
L
L
J
H
STYLE 1:
STYLE 2:
STYLE 3:
PIN 1. SOURCE
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
PIN 1. N−SOURCE
2. N−GATE
3. P−SOURCE
4. P−GATE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. DRAIN
8. DRAIN
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
5. P−DRAIN
6. P−DRAIN
7. N−DRAIN
8. N−DRAIN
SOLDERING FOOTPRINT*
1.04
8X 0.041
0.38
8X
0.015
3.20
4.24
5.28
0.126
0.167 0.208
0.65
6X0.0256
SCALE 8:1
mm
inches
ǒ
Ǔ
Micro8E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
ONSEMI [ ONSEMI ]
