MC33201, MC33202, MC33204, NCV33202, NCV33204
SOIC−8
D, VD SUFFIX
CASE 751−07
ISSUE AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−X−
A
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDAARD IS 751−07
G
MILLIMETERS
INCHES
DIM MIN
MAX
5.00
4.00
1.75
0.51
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
4.80
3.80
1.35
0.33
0.189
0.150
0.053
0.013
0.050 BSC
0.004
0.007
0.016
0
0.010
0.228
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25
0.25
1.27
8
0.010
0.010
0.050
8
M
J
H
D
K
M
N
S
_
_
_
_
0.25
5.80
0.50
6.20
0.020
0.244
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
SOIC−8
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
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