MC10EP101, MC100EP101
PACKAGE DIMENSIONS
32 LEAD LQFP
CASE 873A−02
ISSUE C
4X
A
A1
0.20 (0.008) AB T−U
Z
32
25
1
AE
AE
−U−
−T−
P
B
V
B1
DETAIL Y
BASE
METAL
DETAIL Y
V1
17
8
N
9
4X
−Z−
0.20 (0.008) AC T−U
Z
9
F
D
S1
S
_
8X M
J
R
DETAIL AD
G
SECTION AE−AE
−AB−
−AC−
E
C
SEATING
PLANE
0.10 (0.004) AC
W
_
Q
H
K
X
DETAIL AD
NOTES:
MILLIMETERS
DIM MIN MAX
7.000 BSC
INCHES
MIN MAX
0.276 BSC
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION:
MILLIMETER.
A1
B
3.500 BSC
7.000 BSC
3.500 BSC
0.138 BSC
0.276 BSC
0.138 BSC
3. DATUM PLANE −AB− IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS −T−, −U−, AND −Z− TO BE
DETERMINED AT DATUM PLANE −AB−.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE −AC−.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −AB−.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
B1
C
1.400
1.600 0.055
0.063
0.018
0.057
0.016
D
0.300
1.350
0.300
0.450 0.012
1.450 0.053
0.400 0.012
E
F
G
H
0.800 BSC
0.031 BSC
0.050
0.090
0.450
0.150 0.002
0.200 0.004
0.750 0.018
0.006
0.008
0.030
J
K
_
12 REF
_
12 REF
M
N
0.090
0.160 0.004
0.006
P
0.400 BSC
1_
0.016 BSC
1_
Q
R
5_
5 _
0.150
0.250 0.006
0.010
S
9.000 BSC
0.354 BSC
S1
V
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
V1
W
X
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
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