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LMV931 参数 Datasheet PDF下载

LMV931图片预览
型号: LMV931
PDF下载: 下载PDF文件 查看货源
内容描述: 单路和双路低电压轨至轨输入和输出,运算放大器 [Single and Dual Low Voltage, Rail-to-Rail Input and Output, Operational Amplifiers]
分类和应用: 运算放大器
文件页数/大小: 20 页 / 421 K
品牌: ONSEMI [ ONSEMI ]
 浏览型号LMV931的Datasheet PDF文件第12页浏览型号LMV931的Datasheet PDF文件第13页浏览型号LMV931的Datasheet PDF文件第14页浏览型号LMV931的Datasheet PDF文件第15页浏览型号LMV931的Datasheet PDF文件第16页浏览型号LMV931的Datasheet PDF文件第17页浏览型号LMV931的Datasheet PDF文件第18页浏览型号LMV931的Datasheet PDF文件第20页  
LMV931, LMV932  
PACKAGE DIMENSIONS  
TSOP5  
CASE 48302  
ISSUE H  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS  
OF BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5. OPTIONAL CONSTRUCTION: AN  
ADDITIONAL TRIMMED LEAD IS ALLOWED  
IN THIS LOCATION. TRIMMED LEAD NOT TO  
EXTEND MORE THAN 0.2 FROM BODY.  
NOTE 5  
5X  
D
0.20 C A B  
2X  
2X  
0.10  
T
T
M
5
4
3
0.20  
B
S
1
2
K
L
DETAIL Z  
G
A
MILLIMETERS  
DIM  
A
B
C
D
MIN  
3.00 BSC  
1.50 BSC  
MAX  
DETAIL Z  
J
0.90  
1.10  
0.50  
C
0.25  
SEATING  
PLANE  
0.05  
G
H
J
K
L
M
S
0.95 BSC  
H
0.01  
0.10  
0.20  
1.25  
0
0.10  
0.26  
0.60  
1.55  
10  
3.00  
T
_
_
2.50  
SOLDERING FOOTPRINT*  
1.9  
0.074  
0.95  
0.037  
2.4  
0.094  
1.0  
0.039  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
19  
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