LM337
OUTLINE DIMENSIONS
T SUFFIX
PLASTIC PACKAGE
CASE 221A–06
ISSUE Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIM Z DEFINES A ZONE WHERE ALL BODY AND
LEAD IRREGULARITIES ARE ALLOWED.
INCHES
MIN
MAX
0.570 0.620
0.380 0.405
0.160 0.190
0.025 0.035
0.142 0.147
0.095 0.105
0.110 0.155
0.018 0.025
0.500 0.562
0.045 0.060
0.190 0.210
0.100 0.120
0.080 0.110
0.045 0.055
0.235 0.255
0.000 0.050
–
0.045
0.080
–
MILLIMETERS
MIN
MAX
14.48 15.75
9.66 10.28
4.82
4.07
0.88
0.64
3.73
3.61
2.66
2.42
3.93
2.80
0.64
0.46
12.70 14.27
1.52
1.15
5.33
4.83
3.04
2.54
2.79
2.04
1.39
1.15
6.47
5.97
1.27
0.00
–
1.15
2.04
–
B
F
T
4
C
–T
–
SEATING
PLANE
S
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
Q
1 2 3
A
U
K
H
Z
L
V
G
D
N
D2T SUFFIX
PLASTIC PACKAGE
CASE 936–03
(D2PAK)
ISSUE B
OPTIONAL
CHAMFER
R
J
A
E
–T
–
TERMINAL 4
U
K
B
S
V
H
F
1
2
3
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: INCH.
3 TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4 DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5 DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5
_
REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5
_
REF
2.946 REF
5.080 MIN
6.350 MIN
M
J
D
0.010 (0.254)
M
T
G
N
R
L
P
C
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
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8
◊
MOTOROLA ANALOG IC DEVICE DATA
LM337/D
*LM337/D*
ONSEMI [ ON SEMICONDUCTOR ]
