ESDR0524PMUTAG
PACKAGE DIMENSIONS
UDFN10 2.5x1, 0.5P
CASE 517BB−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
L
L
D
B
E
A
L1
PIN ONE
REFERENCE
DETAIL A
OPTIONAL
CONSTRUCTIONS
MILLIMETERS
2X
0.10 C
DIM
A
MIN
0.45
0.00
MAX
0.55
0.05
A1
A3
b
2X
0.10
C
MOLD CMPD
TOP VIEW
EXPOSED Cu
0.13 REF
0.15
0.35
0.25
0.45
b2
D
DETAIL B
2.50 BSC
A3
A
A3
E
1.00 BSC
0.50 BSC
0.10
0.08
C
C
e
L
0.30
---
0.40
0.05
A1
L1
DETAIL B
10X
A1
OPTIONAL
SEATING
PLANE
CONSTRUCTION
C
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
2X b2
10X
L
10X
0.50
DETAIL A
2X
0.45
5
1
10
6
1.30
e
8X b
PACKAGE
OUTLINE
0.10
0.05
C
C
A
B
8X
0.25
NOTE 3
0.50
PITCH
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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