ADM1032
ADDRESS POINTER
REGISTER
ON-CHIP
TEMPERATURE
SENSOR
CONVERSION RATE
REGISTER
LOCAL TEMPERATURE
VALUE REGISTER
A/D
CONVERTER
BUSY
RUN/STANDBY
REMOTE TEMPERATURE
VALUE REGISTER
LOCAL TEMPERATURE
LOW LIMIT REGISTER
LOCAL TEMPERATURE
HIGH LIMIT REGISTER
DIGITAL MUX
REMOTE TEMPERATURE
LOW LIMIT REGISTER
REMOTE TEMPERATURE
HIGH LIMIT REGISTER
LOCAL THERM LIMIT
REGISTER
REMOTE OFFSET
REGISTER
EXTERNAL THERM LIMIT
REGISTER
CONFIGURATION
REGISTER
EXTERNAL DIODE OPEN-CIRCUIT
STATUS REGISTER
SMBUS INTERFACE
INTERRUPT
MASKING
6
4
ALERT
THERM
D+
D−
2
3
ANALOG
MUX
DIGITAL MUX
LIMIT
COMPARATOR
ADM1032
1
V
DD
5
GND
7
SDATA
8
SCLK
Figure 1. Functional Block Diagram
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Positive Supply Voltage (V
DD
) to GND
D+
D− to GND
SCLK, SDATA, ALERT
THERM
Input Current, SDATA, THERM
Input Current, D−
ESD Rating, All Pins (Human Body Model)
Maximum Junction Temperature (T
J Max
)
Storage Temperature Range
IR Reflow Peak Temperature
IR Reflow Peak Temperature for Pb-Free
Lead Temperature (Soldering 10 sec)
Rating
−0.3,
+5.5
−0.3
to V
DD
+ 0.3
−0.3
to +0.6
−0.3
to +5.5
−0.3
to V
DD
+ 0.3
−1,
+50
1
> 1000
150
−65
to +150
220
260
300
Unit
V
V
V
V
V
mA
mA
V
C
C
C
C
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
Table 2. THERMAL CHARACTERISTICS
Package Type
8-lead SOIC NB Package
8-lead MSOP Package
q
JA
121
142
Unit
C
C
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