74HC374
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
20X
K
REF
M
2X
L/2
20
11
J J1
B
−U−
N
L
PIN 1
IDENT
1
10
0.15 (0.006) T U
S
A
−V−
N
F
DETAIL E
−W−
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
C
D
0.100 (0.004)
−T−
SEATING
PLANE
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.36
16X
16X
1.26
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
SECTION N−N
0.25 (0.010)
M
0.15 (0.006) T U
S
0.10 (0.004)
T U
S
V
S
K
K1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE
−W−.
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0
_
8
_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
−−− 0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0
_
8
_
0.65
PITCH
DIMENSIONS: MILLIMETERS
ONSEMI [ ON SEMICONDUCTOR ]
