74HC132
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
OUT
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
V
ESD
I
Latchup
Positive DC Supply Voltage
Digital Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V
CC
and GND Pins
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
Power Dissipation in Still Air at 85_C
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Latchup Performance
Oxygen Index: 30%
−
35%
Human Body Model (Note 1)
Machine Model (Note 2)
Above V
CC
and Below GND at 85_C (Note 3)
14−SOIC
14−TSSOP
SOIC
TSSOP
Output in 3−State
High or Low State
Parameter
Value
*0.5
to
)7.0
*0.5
to
)7.0
*0.5
to
)7.0
*0.5
to V
CC
)0.5
*20
$20
$25
$75
$75
*65
to
)150
260
)150
125
170
500
450
Level 1
UL 94 V−0 @ 0.125 in
u2000
u200
$300
V
mA
Unit
V
V
V
mA
mA
mA
mA
mA
_C
_C
_C
_C/W
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to EIA/JESD78.
4. For high frequency or heavy load considerations, see Chapter 2the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
, V
OUT
T
A
t
r
, t
f
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 3)
Min
2.0
0
*55
−
Max
6.0
V
CC
)125
No Limit
(Note 5)
Unit
V
V
_C
ns
5. When V
IN
X
0.5 V
CC
, I
CC
>> quiescent current.
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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