74HC08
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
– 0.5 to + 7.0
CC
V
– 0.5 to V + 0.5
V
in
CC
V
– 0.5 to V + 0.5
V
out
CC
I
±20
±25
±50
mA
mA
mA
mW
in
cuit. For proper operation, V and
in
I
I
DC Output Current, per Pin
out
V
out
should be constrained to the
range GND v (V or V ) v V
.
DC Supply Current, V and GND Pins
in
out
CC
CC
CC
Unused inputs must always be
tied to an appropriate logic voltage
P
Power Dissipation in Still Air,
SOIC Package†
TSSOP Package†
500
450
D
level (e.g., either GND or V ).
CC
Unused outputs must be left open.
T
Storage Temperature
– 65 to + 150
_C
_C
stg
T
Lead Temperature, 1 mm from Case for 10 Seconds
SOIC or TSSOP Package
L
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
0
Max
Unit
V
V
DC Supply Voltage (Referenced to GND)
6.0
CC
V , V
in out
DC Input Voltage, Output Voltage (Referenced to
GND)
V
V
CC
T
Operating Temperature Range, All Package Types
– 55
+ 125
_C
ns
A
t , t
r
Input Rise/Fall Time
(Figure 1)
V
V
V
= 2.0 V
= 4.5 V
= 6.0 V
0
0
0
1000
500
400
f
CC
CC
CC
ORDERING INFORMATION
Device
†
Package
Shipping
74HC08DR2G
SOIC−14
(Pb−Free)
2500/Tape & Reel
74HC08DTR2G
TSSOP−14*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
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