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0W344-004-XTP 参数 Datasheet PDF下载

0W344-004-XTP图片预览
型号: 0W344-004-XTP
PDF下载: 下载PDF文件 查看货源
内容描述: 1.0 GENRAL说明 [1.0 Genral Description]
分类和应用: 微控制器和处理器外围集成电路数字信号处理器时钟
文件页数/大小: 43 页 / 1433 K
品牌: ONSEMI [ ONSEMI ]
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BelaSigna 200  
Alternative surface finishes are ENiG and OSP; volume of screened solder paste (#5) should be less than 0.0008mm^3. If no pre-  
screening of solder paste is used, then following conditions must be met:  
(i) the solder mask opening should be >0.3mm in diameter,  
(ii) the copper pad will have 0.25mm diameter, and  
(iii) soldermask thickness should be less than 1mil thick above the copper surface.  
ON Semiconductor can provide BelaSigna 200 CSP landpattern CAD files to assist your PCB design upon request.  
Rev. 16 | Page 14 of 43 | www.onsemi.com