BelaSigna 200
Alternative surface finishes are ENiG and OSP; volume of screened solder paste (#5) should be less than 0.0008mm^3. If no pre-
screening of solder paste is used, then following conditions must be met:
(i) the solder mask opening should be >0.3mm in diameter,
(ii) the copper pad will have 0.25mm diameter, and
(iii) soldermask thickness should be less than 1mil thick above the copper surface.
ON Semiconductor can provide BelaSigna 200 CSP landpattern CAD files to assist your PCB design upon request.
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