NCV8702
PACKAGE DIMENSIONS
XDFN6 1.5x1.5, 0.5P
CASE 711AE
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.10 AND 0.20mm FROM TERMINAL TIP.
L
D
A
B
L1
DETAIL A
MILLIMETERS
ALTERNATE TERMINAL
CONSTRUCTIONS
DIM
A
MIN
0.35
0.00
MAX
0.45
0.05
E
PIN ONE
REFERENCE
A1
A3
b
0.13 REF
EXPOSED Cu
MOLD CMPD
0.20
0.30
2X
0.10
C
1.50 BSC
D
E
1.50 BSC
0.50 BSC
e
2X
0.10
C
L
0.40
---
0.60
0.15
0.70
TOP VIEW
L1
L2
DETAIL B
0.50
ALTERNATE
A
DETAIL B
CONSTRUCTIONS
0.05
0.05
C
C
A3
A1
RECOMMENDED
MOUNTING FOOTPRINT*
SEATING
PLANE
C
SIDE VIEW
5X
0.73
6X
0.35
DETAIL A
1
e
5X
L
3
L2
1.80
0.50
PITCH
0.83
6
4
DIMENSIONS: MILLIMETERS
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10
C
C
A
B
NOTE 3
0.05
BOTTOM VIEW
http://onsemi.com
19
ONSEMI [ ONSEMI ]
