PEDL9041A-02
OKI Semiconductor
ML9041A-xxA/xxB
ML9041A-xxA/xxBCVWA GOLD BUMP SPECIFICATION
Gold Bump Specification
µ
(Unit: m)
Symbol
Parameter
Bump Pitch (Min Section: Output Section)
Bump Size (Output Section: Pitch Direction)
Bump Size (Output Section: Depth Direction)
Bump-to-Bump Distance (Output Section: Pitch Direction)
Bump Size (Input Section: Pitch Direction)
Bump Size (Input Section: Depth Direction)
Bump-to-Bump Distance (Input Section: Pitch Direction)
Sliding of Total Bump Pitches
MIN
84
49
91
25
67
67
112
—
TYP
—
MAX
—
A
B
C
D
E
F
54
96
30
72
72
117
—
59
101
35
77
77
122
2
G
H
Bump Height
10
—
15
—
20
4
I
Bump Height Dispersion Inside Chip (Range)
Bump Edge Height
J
K
L
—
—
5
Shear Strength (g)
30
50
—
—
Bump Hardness (Hv: 25 g load)
90
130
ꢀꢀ
×
Chip Size; 10.62 mm 2.55 mm
ꢀꢀ
±
µ
Chip Thickness; 625 20 m
Top View and Cross Section View
A
B•E
D•F
Top View
Cross Section View
62/64
OKI [ OKI ELECTRONIC COMPONETS ]
