TDA8922C
NXP Semiconductors
2 × 75 W class-D power amplifier
16.4 Package related soldering information
Table 14. Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP[2]
suitable
-
suitable[1]
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
17. Revision history
Table 15. Revision history
Document ID
Release date
20090907
Data sheet status
Change notice
Supersedes
TDA8922C_1
Product data sheet
-
-
TDA8922C_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 7 September 2009
38 of 40
NXP [ NXP ]
