TDA8920C
NXP Semiconductors
2 × 110 W class-D power amplifier
16.4 Package related soldering information
Table 14. Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP[2]
suitable
-
suitable[1]
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
17. Revision history
Table 15. Revision history
Document ID
TDA8920C_2
Modifications
Release date
20090611
Data sheet status
Change notice
Supersedes
Product data sheet
TDA8920C_1
• Parameter values revised throughout.
• Revised Figure 4 and Figure 10.
• Graphs updated (Figure 11 to Figure 27)
• Some minor additions/corrections to text
TDA8920C_1
20080929
Preliminary data sheet
-
-
TDA8920C_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 11 June 2009
37 of 39
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