TDA6650TT; TDA6651TT
NXP Semiconductors
5 V mixer/oscillator and low noise PLL synthesizer
14. Package outline
TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm;
lead pitch 0.5 mm
SOT510-1
E
H
D
A
X
c
v
M
A
y
E
Z
20
38
A
(A )
3
2
A
A
1
pin 1 index
θ
L
p
L
1
19
detail X
w
M
b
e
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
A
(1)
(2)
(1)
Z
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
v
w
y
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
0.95
0.85
0.27
0.17
0.20
0.09
9.8
9.6
4.5
4.3
0.7
0.5
0.49
0.21
mm
1.1
0.5
1
0.2
0.25
6.4
0.08
0.08
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-02-18
05-11-02
SOT510-1
MO-153
Fig 31. Package outline SOT510-1 (TSSOP38)
TDA6650TT_6651TT_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 10 January 2007
48 of 54
NXP [ NXP ]
