NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
WLCSP8: wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm
TDA1308AUK
D
B
A
bump A1
index area
A
2
E
A
A
1
detail X
e
1
1/2 e
1
b
∅
v
∅
w
M
M
C A B
C
C
y
E
1/4 e
2
D
1/2 e
2
C
e
2
B
A
1
2
3
0
0.25
scale
0.5 mm
X
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max
0.49
A
1
0.10
0.07
A
2
0.39
0.37
b
0.123
0.091
D
0.65
0.57
E
0.88
0.80
e
1
e
2
v
0.15
w
0.05
y
0.08
0.396 0.588
OUTLINE
VERSION
TDA1308AUK
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
06-11-20
06-12-15
Fig 15. Package outline TDA1308AUK (WLCSP8)
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
13 of 19