NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
13. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
seating plane
M
E
A
2
A
L
A
1
c
Z
e
b
1
w
M
(e
1
)
b
2
5
M
H
b
8
pin 1 index
E
1
4
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
4.2
0.17
A
1
min.
0.51
0.02
A
2
max.
3.2
0.13
b
1.73
1.14
0.068
0.045
b
1
0.53
0.38
0.021
0.015
b
2
1.07
0.89
0.042
0.035
c
0.36
0.23
0.014
0.009
D
(1)
9.8
9.2
0.39
0.36
E
(1)
6.48
6.20
0.26
0.24
e
2.54
0.1
e
1
7.62
0.3
L
3.60
3.05
0.14
0.12
M
E
8.25
7.80
0.32
0.31
M
H
10.0
8.3
0.39
0.33
w
0.254
0.01
Z
(1)
max.
1.15
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT97-1
REFERENCES
IEC
050G01
JEDEC
MO-001
JEITA
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 12. Package outline SOT97-1 (DIP8)
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
10 of 19
PHILIPS [ NXP SEMICONDUCTORS ]
