Philips Semiconductors
Product specification
8-bit A/D and D/A converter
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
8
8.1
8.2
8.3
8.4
8.5
9
10
11
12
13
14
15
16
17
17.1
17.2
17.3
17.4
18
19
20
21
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Addressing
Control byte
D/A conversion
A/D conversion
Reference voltage
Oscillator
CHARACTERISTICS OF THE I
2
C-BUS
Bit transfer
Start and stop conditions
System configuration
Acknowledge
I
2
C-bus protocol
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
D/A CHARACTERISTICS
A/D CHARACTERISTICS
AC CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINES
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
PCF8591
2003 Jan 27
2
PHILIPS [ NXP SEMICONDUCTORS ]
