NXP Semiconductors
PCA9555
16-bit I
2
C-bus and SMBus I/O port with interrupt
I
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
I
Six packages offered: DIP24, SO24, SSOP24, TSSOP24, HVQFN24 and HWQFN24
3. Ordering information
Table 1.
Ordering information
Name
PCA9555N
PCA9555D
PCA9555DB
DIP24
SO24
SSOP24
Description
plastic dual in-line package; 24 leads (600 mil)
plastic small outline package; 24 leads;
body width 7.5 mm
plastic shrink small outline package; 24 leads;
body width 5.3 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4
×
4
×
0.85 mm
Version
SOT101-1
SOT137-1
SOT340-1
SOT355-1
SOT616-1
SOT994-1
Type number Package
PCA9555PW TSSOP24
PCA9555BS
PCA9555HF
HVQFN24
HWQFN24 plastic thermal enhanced very very thin quad flat
package; no leads; 24 terminals; body 4
×
4
×
0.75 mm
3.1 Ordering options
Table 2.
PCA9555N
PCA9555D
PCA9555DB
PCA9555PW
PCA9555BS
PCA9555HF
Ordering options
Topside mark
PCA9555
PCA9555D
PCA9555
PCA9555
9555
P55H
Temperature range
−40 °C
to +85
°C
−40 °C
to +85
°C
−40 °C
to +85
°C
−40 °C
to +85
°C
−40 °C
to +85
°C
−40 °C
to +85
°C
Type number
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
2 of 34
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