LPC2210/2220
NXP Semiconductors
16/32-bit ARM microcontrollers
N LPC2210/01 and LPC2220 only: UART0/1 include fractional baud rate generator,
auto-bauding capabilities, and handshake flow-control fully implemented in
hardware.
I Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.
I Configurable external memory interface with up to four banks, each up to 16 MB and
8/16/32-bit data width.
I Up to 76 general purpose pins (5 V tolerant) capable. Up to nine edge/level sensitive
external interrupt pins available.
N LPC2210/01 and LPC2220 only: Fast GPIO ports enable port pin toggling up to 3.5
times faster than the original device. They also allow for a port pin to be read at any
time regardless of its function.
I 60 MHz (LPC2210) and 75 MHz (LPC2210/01 and LPC2220) maximum CPU clock
available from programmable on-chip Phase-Locked Loop (PLL) with settling time of
100 µs.
I On-chip integrated oscillator operates with external crystal in range of 1 MHz to
25 MHz and with external oscillator up to 25 MHz.
I Power saving modes include Idle and Power-down.
I Processor wake-up from Power-down mode via external interrupt.
I Individual enable/disable of peripheral functions for power optimization.
I Dual power supply:
N CPU operating voltage range of 1.65 V to 1.95 V (1.8 V ± 0.15 V).
N I/O power supply range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O pads.
16/32-bit ARM7TDMI-S processor.
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC2210FBD144
LQFP144
plastic low profile quad flat package; 144
SOT486-1
leads; body 20 × 20 × 1.4 mm
LPC2210FBD144/01 LQFP144
plastic low profile quad flat package; 144
leads; body 20 × 20 × 1.4 mm
SOT486-1
SOT486-1
SOT569-2
SOT569-2
LPC2220FBD144
LPC2220FET144
LQFP144
plastic low profile quad flat package; 144
leads; body 20 × 20 × 1.4 mm
TFBGA144 plastic thin fine-pitch ball grid array package;
144 balls; body 12 × 12 × 0.8 mm
LPC2220FET144/G TFBGA144 plastic thin fine-pitch ball grid array package;
144 balls; body 12 × 12 × 0.8 mm
LPC2210_2220_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 11 December 2008
2 of 50
NXP [ NXP ]
