NXP Semiconductors
HEF4027B
Dual JK flip-flop
14. Abbreviations
Table 11.
Acronym
DUT
ESD
HBM
MM
Abbreviations
Description
Device Under Test
ElectroStatic Discharge
Human Body Model
Machine Model
15. Revision history
Table 12.
Revision history
Release date
20081110
Data sheet status
Product data sheet
Change notice
-
Supersedes
HEF4027B_4
Document ID
HEF4027B_5
Modifications:
•
•
•
Maximum T
amb
changed to 85
°C
and T
amb
= 125
°C
parameter data removed throughout.
temperature range statement modified.
I
DD
, I
OL
, I
OH
and I
I
values revised.
Product specification
Product specification
Product specification
-
-
-
HEF4027B_CNV_3
HEF4027B_CNV_2
-
HEF4027B_4
HEF4027B_CNV_3
HEF4027B_CNV_2
20080703
19950101
19950101
HEF4027B_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 10 November 2008
11 of 13
PHILIPS [ NXP SEMICONDUCTORS ]
