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F87EHHD 参数 Datasheet PDF下载

F87EHHD图片预览
型号: F87EHHD
PDF下载: 下载PDF文件 查看货源
内容描述: [FXTH87E, Family of Tire Pressure Monitor Sensors]
分类和应用:
文件页数/大小: 183 页 / 1700 K
品牌: NXP [ NXP ]
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NXP Semiconductors  
FXTH87E  
FXTH87E, Family of Tire Pressure Monitor Sensors  
L1 and matching network  
optimized for specific PWB and  
antenna layout. Recommend  
0603 minimum size for L1 and  
R2 and  
recommended for  
highest EMC resistance  
R2  
R3  
other matching network inductors  
for maximum efficiency.  
BKGD/PTA4  
RESET  
AVDD  
VDD  
antenna  
L1  
RF  
MATCHING  
NETWORK  
3.0 V  
battery  
0.1  
F
0.1 F  
VSS  
AVSS  
RVSS  
VREG  
LFA  
LF  
coil  
R1  
C1  
FXTH87E  
C4  
LFB  
XI  
PTA0  
XTAL  
XO  
PTA1  
PTA2  
PTA3  
PTB0  
PTB1  
C2, C3, C4  
optimized  
for crystal  
C5  
470 nF  
C2  
C3  
general  
purpose I/O  
aaa-027994  
Figure 5.ꢀFXTH87E example application  
The device labeled C4 in Figure 5, is drawn as a capacitor but may be any type of  
passive component(s) sufficient to block or reduce unwanted external radiated signals  
from corrupting the crystal oscillator circuit: PCB traces for the LFA/LFB, AVDD/VDD,  
and VSS/AVSS pins and bypass capacitors should be minimized to reduce unwanted  
external radiated signals from corrupting the power input circuits.  
Care must be taken by the application to ensure the pressure applied to all surfaces of  
the sensor remains equal. The sensor is constructed from nonhermetic materials and  
should not be used as a seal between the tire pressure and the ambient environment  
pressure.The seal should be provided by the final module design and not by the surfaces  
of the sensor.  
Note: A gel is used to provide media protection against corrosive elements which  
may otherwise damage metal bond wires and/or IC surfaces. Highly pressurized gas  
molecules may permeate through the gel and then occupy boundaries between material  
surfaces within the sensor package. When decompression occurs, the gas molecules  
may collect, form bubbles and possibly result in delamination of the gel from the material  
it protects. If a bubble is located on the pressure transducer surface or on the bond wires,  
the sensor measurement may shift from its calibrated transfer function. In some cases,  
these temporary shifts could be outside the tolerances listed in the data sheet. In rare  
cases, the bubble may bend the bond wires and result in a permanent shift.  
4.4 Signal properties  
The following sections describe the general function of each pin.  
FXTH87ERM  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2019. All rights reserved.  
Reference manual  
Rev. 5.0 — 4 February 2019  
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