NXP Semiconductors
FXTH87E
FXTH87E, Family of Tire Pressure Monitor Sensors
• Six-channel, 10-bit analog-to-digital converter (ADC10) with two external
I/O inputs
• 8-bit MCU
– S08 Core with SIM and interrupt
– 512 RAM
– 16 KB FLASH
– 64-byte, low-power, parameter registers
• Dedicated state machines to sequence routine measurement and transmission
processes for reduced power consumption
• Internal 315-/434-MHz RF transmitter
– External crystal oscillator
– PLL-based output with fractional-n divider
– OOK and FSK modulation capability
– Programmable data rate generator
– Manchester, Bi-Phase or NRZ data encoding
– 256-bit RF data buffer variable length interrupt
– Direct access to RF transmitter from MCU for unique formats
– Low-power consumption
• Differential input LF detector/decoder on independent signal pins
• Seven multipurpose GPIO pins
– Four pins can be connected to optional internal pullups/pulldowns and STOP4
wakeup interrupt
– Two of seven pins can be connected to a channel on the ADC10
– Two of seven pins can be connected to a channel on the TPM1
• Real-time Interrupt driven by LFO with interrupt intervals of 2, 4, 8, 16, 32, 64, or 128
ms
• Free-running counter, low-power, wakeup timer and periodic reset driven by LFO
• Watchdog timeout with selectable times and clock sources
• Two-channel general purpose timer/PWM module (TPM1)
• Internal oscillators
– MCU bus clock of 0.5, 1, 2, and 4 MHz (1, 2, 4, and 8 MHz HFO)
– Low frequency, low power time clock (LFO) with 1 ms period
– Medium frequency, controller clock (MFO) of 8 μs period
• Low-voltage detection
• Normal temperature restart in hardware (over- or under-temperature detected by
software)
2.3 Configuration options
Table 1.ꢀConfiguration options
Accelerometer
configuration
Pressure range
X-axis range
Z-axis range
Package
Z
XZ
Z
N/A
–285 g to +400 g
–215 g to +305 g
–285 g to +400 g
–285 g to +400 g
–215 g to +305 g
–285 g to +400 g
100 to 500 kPa
–80 g to +90 g
NA
98ASA00432D
(7 x 7 x 2.2 mm)
100 to 900 kPa
XZ
–80 g to +90 g
FXTH87ERM
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Reference manual
Rev. 5.0 — 4 February 2019
2 / 183