NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
2.65
0.60
(2×)
2.35
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
0.50
(4×)
0.50
(4×)
0.40 0.90 2.10
(2×)
1.20
2.40
sot363
Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88)
5.25
4.50
0.30 1.00 4.00
solder lands
solder resist
occupied area
1.15
3.75
transport direction during soldering
sot363
Dimensions in mm
Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88)
BAV756S_BAW56_SER_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 26 November 2007
11 of 15
PHILIPS [ NXP SEMICONDUCTORS ]
