NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
3
4.60 4.00 1.20
Dimensions in mm
2.80
4.50
preferred transport direction during soldering
sot023
Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)
1.30
R = 0.05 (12×)
0.30
R = 0.05 (12×)
0.35
(2×)
0.90 0.20
0.25
(2×)
0.60 0.70 0.80
0.30
(2×)
0.40
(2×)
0.50
(2×)
0.30
0.40
0.50
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)
BAV756S_BAW56_SER_5
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 05 — 26 November 2007
10 of 15
PHILIPS [ NXP SEMICONDUCTORS ]
