28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Contents
1.0 Introduction ...............................................................................................................................7
1.1
1.2
Nomenclature .......................................................................................................................7
Conventions..........................................................................................................................8
2.0 Functional Overview ..............................................................................................................8
3.0 Functional Overview ..............................................................................................................9
3.1
3.2
Architecture Diagram..........................................................................................................10
Memory Maps and Block Organization...............................................................................11
3.2.1 Parameter Blocks ..................................................................................................11
3.2.2 Main Blocks ...........................................................................................................11
3.2.3 4-Mbit, 8-Mbit, 16-Mbit, 32-Mbit, and 64-Mbit Word-Wide Memory Maps .............11
3.2.4 4-Mbit, 8-Mbit, and 16-Mbit Byte-Wide Memory Maps...........................................20
4.0 Package Information............................................................................................................24
4.1
4.2
4.3
mBGA* and Very Thin Profile Fine Pitch Ball Grid Array (VF BGA) Package ....................24
TSOP Package...................................................................................................................25
Easy BGA Package ............................................................................................................26
5.0 Pinout and Signal Descriptions.......................................................................................27
5.1
Signal Pinouts.....................................................................................................................27
5.1.1 40-Lead and 48-Lead TSOP Packages.................................................................27
Signal Descriptions .............................................................................................................30
5.2
6.0 Maximum Ratings and Operating Conditions ...........................................................32
6.1
6.2
Absolute Maximum Ratings................................................................................................32
Operating Conditions..........................................................................................................33
7.0 Electrical Specifications.....................................................................................................34
7.1
7.2
DC Current Characteristics.................................................................................................34
DC Voltage Characteristics.................................................................................................36
8.0 AC Characteristics................................................................................................................37
8.1
8.2
8.3
8.4
8.5
AC Read Characteristics ....................................................................................................37
AC Write Characteristics.....................................................................................................41
Erase and Program Timing.................................................................................................45
AC I/O Test Conditions.......................................................................................................46
Device Capacitance............................................................................................................46
9.0 Power and Reset Specifications .....................................................................................47
9.1
Power-Up/Down Characteristics.........................................................................................47
9.1.1 RP# Connected to System Reset ..........................................................................47
9.1.2
V
, V
and RP# Transitions..............................................................................47
CC
PP,
9.2
9.3
Reset Specifications ...........................................................................................................48
Power Supply Decoupling...................................................................................................49
Datasheet
Intel® Advanced Boot Block Flash Memory (B3)
Order Number: 290580, Revision: 020
18 Aug 2005
3
NUMONYX [ NUMONYX B.V ]
