欢迎访问ic37.com |
会员登录 免费注册
发布采购

LM4863MT 参数 Datasheet PDF下载

LM4863MT图片预览
型号: LM4863MT
PDF下载: 下载PDF文件 查看货源
内容描述: 双2.2W音频放大器加上立体声耳机功能 [Dual 2.2W Audio Amplifier Plus Stereo Headphone Function]
分类和应用: 音频放大器
文件页数/大小: 16 页 / 515 K
品牌: NSC [ National Semiconductor ]
 浏览型号LM4863MT的Datasheet PDF文件第1页浏览型号LM4863MT的Datasheet PDF文件第2页浏览型号LM4863MT的Datasheet PDF文件第3页浏览型号LM4863MT的Datasheet PDF文件第4页浏览型号LM4863MT的Datasheet PDF文件第6页浏览型号LM4863MT的Datasheet PDF文件第7页浏览型号LM4863MT的Datasheet PDF文件第8页浏览型号LM4863MT的Datasheet PDF文件第9页  
External Components Description  
(Figure 1 )  
Components  
Functional Description  
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a  
1.  
Ri  
=
high pass filter with C at fc 1/(2πRiCi).  
i
2.  
Ci  
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a  
=
highpass filter with Ri at fc 1/(2πRiCi). Refer to the section, Proper Selection of External Components,  
for an explanation of how to determine the value of Ci.  
3.  
4.  
Rf  
Feedback resistance which sets the closed-loop gain in conjunction with Ri.  
Cs  
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing  
section for information concerning proper placement and selection of the supply bypass capacitor.  
5.  
CB  
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of  
External Components, for information concerning proper placement and selection of CB.  
Typical Performance Characteristics  
MTE Specific Characteristics  
LM4863MTE  
THD+N vs Output Power  
LM4863MTE  
THD+N vs Frequency  
LM4863MTE  
THD+N vs Output Power  
DS012881-97  
DS012881-99  
DS012881-96  
LM4863MTE  
THD+N vs Frequency  
LM4863MTE  
Power Dissipation vs Power Output  
LM4863MTE(Note 16)  
Power Derating Curve  
DS012881-90  
DS012881-98  
DS012881-95  
Note 16: These curves show the thermal dissipation ability of the LM4863MTE at different ambient temperatures given these conditions:  
500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across  
it. Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.  
2
2
500LFPM + 2.5in : The part is soldered to a 2.5in , 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.  
2
2
2.5in : The part is soldered to a 2.5in , 1oz. copper plane.  
Not Attached: The part is not soldered down and is not forced-air cooled.  
5
www.national.com  
 复制成功!