LM118/LM218/LM318
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
Power Dissipation (Note 2)
Differential Input Current (Note 3)
Input Voltage (Note 4)
Output Short-Circuit Duration
Operating Temperature Range
LM118
LM218
LM318
Storage Temperature Range
−55˚C to +125˚C
−25˚C to +85˚C
0˚C to +70˚C
−65˚C to +150˚C
Lead Temperature (Soldering, 10 sec.)
Hermetic Package
Plastic Package
Soldering Information
Dual-In-Line Package
Soldering (10 sec.)
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
215˚C
220˚C
260˚C
300˚C
260˚C
±
20V
500 mW
±
10 mA
±
15V
Continuous
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
ESD Tolerance (Note 8)
2000V
Electrical Characteristics
Parameter
Input Offset Voltage
Input Offset Current
Input Bias Current
Input Resistance
Supply Current
Large Signal Voltage Gain
Slew Rate
Small Signal Bandwidth
Input Offset Voltage
Input Offset Current
Input Bias Current
Supply Current
Large Signal Voltage Gain
Output Voltage Swing
Input Voltage Range
Common-Mode Rejection Ratio
Supply Voltage Rejection Ratio
T
A
= 125˚C
V
S
=
±
15V, V
OUT
=
±
10V
R
L
≥
2 kΩ
V
S
=
±
15V, R
L
= 2 kΩ
V
S
=
±
15V
25
4.5
T
A
= 25˚C
T
A
= 25˚C
T
A
= 25˚C
T
A
= 25˚C
T
A
= 25˚C
T
A
= 25˚C, V
S
=
±
15V
V
OUT
=
±
10V, R
L
≥
2 kΩ
T
A
= 25˚C, V
S
=
±
15V, A
V
= 1
T
A
= 25˚C, V
S
=
±
15V
15
6
100
500
7
20
15
15
300
750
MHz
mV
nA
nA
mA
V/mV
50
70
50
70
V/µs
50
1
Conditions
LM118/LM218
Min
Typ
2
6
120
3
5
200
8
25
Max
4
50
250
0.5
Min
LM318
Typ
4
30
150
3
5
200
10
Max
10
200
500
mV
nA
nA
MΩ
mA
V/mV
Units
±
12
±
11.5
80
70
±
13
100
80
±
12
±
11.5
70
65
±
13
100
80
V
V
dB
dB
Note 2:
The maximum junction temperature of the LM118 is 150˚C, the LM218 is 110˚C, and the LM318 is 110˚C. For operating at elevated temperatures, devices
in the H08 package must be derated based on a thermal resistance of 160˚C/W, junction to ambient, or 20˚C/W, junction to case. The thermal resistance of the
dual-in-line package is 100˚C/W, junction to ambient.
Note 3:
The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a differential input voltage in excess of
1V is applied between the inputs unless some limiting resistance is used.
Note 4:
For supply voltages less than
±
15V, the absolute maximum input voltage is equal to the supply voltage.
Note 5:
These specifications apply for
±
5V
≤
V
S
≤
±
20V and −55˚C
≤
T
A
≤
+125˚C (LM118), −25˚C
≤
T
A
≤
+85˚C (LM218), and 0˚C
≤
T
A
≤
+70˚C (LM318). Also,
power supplies must be bypassed with 0.1 µF disc capacitors.
Note 6:
Slew rate is tested with V
S
=
±
15V. The LM118 is in a unity-gain non-inverting configuration. V
IN
is stepped from −7.5V to +7.5V and vice versa. The slew
rates between −5.0V and +5.0V and vice versa are tested and guaranteed to exceed 50V/µs.
Note 7:
Refer to RETS118X for LM118H and LM118J military specifications.
Note 8:
Human body model, 1.5 kΩ in series with 100 pF.
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