Package Specifications (Continued)
Table 7-3. Mechanical Package Outline Legend
Symbol
Meaning
A
A1
A2
aaa
B
Distance from seating plane datum to highest point of body
Solder ball height
Laminate thickness (excluding heat spreader)
Coplanarity
Pin or solder ball diameter
D
Largest overall package outline dimension
Length from outer pin center to outer pin center
Heat spreader outline dimension
D1
D2
E1
BGA: Solder ball pitch
SPGA: Linear spacing between true pin position centerlines
E2
F
Diagonal spacing between true pin position centerlines
Flatness
L
Distance from seating plane to tip of pin
Length from outer pin/ball center to edge of laminate
S1
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