SM5010 series
PAD LAYOUT
PINOUT
(Unit: µm)
(Top view)
VDD
Q
(920,1180)
1
2
3
4
8
7
6
5
VDD
NC
NC
Q
HA5010
INHN
Y
XT
XTN
VSS
(0,0)
INHN XT XTN VSS
X
Chip size: 0.92 × 1.18mm
Chip thickness: 300 30ꢀm
Chip base: V level
DD
PIN DESCRIPTION and PAD DIMENSIONS
Pad dimensions [µm]
Number
Name
I/O
Description
X
Y
Output state control input. Standby mode when LOW, pull-up resistor built in. In
the case of the 5010CL×, the oscillator stops and Power-saving pull-up resistor is
built-in to reduce current consumption at standby mode.
1
INHN
I
195
174.4
2
3
4
XT
I
Amplifier input.
385
575
765
174.4
174.4
174.4
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XTN
Amplifier output.
XTN
VSS
O
–
Ground
Output. Output frequency (f , f /2, f /4, f /8, f /16) determined by internal
O
connection
O
O
O
O
5
Q
O
757.6
1017.6
6
7
8
NC
NC
–
–
–
No connection
No connection
Supply voltage
–
–
–
–
VDD
165.4
1014.6
SEIKO NPC CORPORATION —3
NPC [ NIPPON PRECISION CIRCUITS INC ]
