WF5028 series
SERIES CONFIGURATION
Standby mode
Operating
supply voltage
range [V]
Recommended
oscillation frequency
Output drive
capability [mA]
(V = 1.2V)
DD
Oscillation
mode
Output
frequency
*1
Version
Oscillator stop
function
*2
Output state
range [MHz]
f
(oscillation
frequency)
O
WF5028×1
WF5028×2
WF5028×ꢀ
WF5028×4
WF5028×5
WF5028×6
WF5028×7
f /2
O
f /4
O
0.8 to 2.0
Fundamental
20 to 50
ꢀ
Yes
Hi-Z
f /8
O
f /16
O
f /ꢀ2
O
f /64
O
*1. Chip form devices have designation CF5028××.
*2. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the
oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting condi-
tions, so the oscillation characteristics of components must be carefully evaluated.
VERSION NAME
Device
Package
Version name
WF5028
−4
WF5028××–4
Wafer form
Form WF: Wafer form
CF: Chip (Die) form
Frequency divider function
Pad layout type A: for Flip Chip Bonding
B: for Wire Bonding (type I)
CF5028××–4
Chip form
C: for Wire Bonding (type II)
SEIKO NPC CORPORATION —2