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NVSL219BT 参数 Datasheet PDF下载

NVSL219BT图片预览
型号: NVSL219BT
PDF下载: 下载PDF文件 查看货源
内容描述: 无铅回流焊接的应用,内置ESD保护器件 [Pb-free Reflow Soldering Application, Built-in ESD Protection Device]
分类和应用:
文件页数/大小: 20 页 / 337 K
品牌: NICHIA [ NICHIA CORPORATION ]
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NICHIA STS-DA1-2009E <Cat.No.120828>  
CAUTIONS  
(1) Storage  
Conditions  
Temperature  
30°C  
Humidity  
90%RH  
Time  
Within 1 Year from Delivery Date  
168hours  
Before Opening Aluminum Bag  
After Opening Aluminum Bag  
Storage  
Baking  
30°C  
70%RH  
65±5°C  
-
24hours  
Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.  
Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination  
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags  
to minimize moisture absorption during transportation and storage.  
Included silica gel desiccants change from blue to red if moisture had penetrated bags.  
After opening the moisture-proof aluminum bag, the products should go through the soldering process  
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants  
in a hermetically sealed container, preferably the original moisture-proof bags for storage.  
After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,  
the products should be baked. Baking should only be done once.  
Although the leads or electrode pads (anode and cathode) of the product are plated with gold,  
prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish,  
and thus leading to difficulties in soldering. If unused LEDs remain, they must be stored in a hermetically sealed container.  
Nichia recommends using the original moisture-proof bag for storage.  
Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.  
The contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals.  
Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products,  
caused by low molecular weight volatile siloxane.  
To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.  
(2) Directions for Use  
When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.  
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.  
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation  
in Forward Voltage characteristics of the LEDs.  
(A)  
(B)  
LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.  
Continuous reverse voltage can cause migration and LED damage.  
It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.  
For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.  
(3) Handling Precautions  
Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.  
In the worst case, catastrophic failure from excess pressure through bump-bond breaks and package damage may result.  
When handling the product with tweezers, be careful not to apply excessive force to the resin.  
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing bump-bond breaks and catastrophic failures.  
Dropping the product may cause damage.  
Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,  
delaminated and/or deformed. It may cause bump to break, leading to catastrophic failures.  
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