NICHIA STS-DA1-2009E <Cat.No.120828>
RELIABILITY
(1) Tests and Results
Test
Failure
Reference
Standard
Test
Units
Test Conditions
Criteria
#
Duration
Failed/Tested
Resistance to
JEITA ED-4701
300 301
Tsld=260°C, 10sec, 2reflows,
Soldering Heat
(Reflow Soldering)
Solderability
#1
0/22
Precondition: 30°C, 70%RH, 168hr
JEITA ED-4701
303 303A
Tsld=245±5°C, 5sec,
#2
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
#1
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/10
0/22
(Reflow Soldering)
Lead-free Solder(Sn-3.0Ag-0.5Cu)
-40°C(30min)~25°C(5min)~
100°C(30min)~25°C(5min)
25°C~65°C~-10°C, 90%RH,
24hr per cycle
JEITA ED-4701
100 105
Temperature Cycle
100cycles
10cycles
Moisture Resistance
(Cyclic)
JEITA ED-4701
200 203
High Temperature
Storage
JEITA ED-4701
200 201
TA=100°C
1000hours
1000hours
1000hours
1000hours
1000hours
500hours
1000hours
48minutes
Temperature Humidity
Storage
JEITA ED-4701
100 103
TA=60°C, RH=90%
TA=-40°C
Low Temperature
Storage
JEITA ED-4701
200 202
Room Temperature
Operating Life
High Temperature
Operating Life
Temperature Humidity
Operating Life
Low Temperature
Operating Life
TA=25°C, IF=1000mA
Test board: See NOTES below
TA=100°C, IF=400mA
Test board: See NOTES below
60°C, RH=90%, IF=700mA
Test board: See NOTES below
TA=-40°C, IF=700mA
Test board: See NOTES below
200m/s2, 100~2000~100Hz,
4cycles, 4min, each X, Y, Z
HBM, 2kV, 1.5kΩ, 100pF, 3pulses,
alternately positive or negative
JEITA ED-4701
400 403
Vibration
JEITA ED-4701
300 304
Electrostatic Discharges
NOTES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈35°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
(2) Failure Criteria
Criteria #
Items
Conditions
IF=700mA
Failure Criteria
>Initial value×1.1
Forward Voltage(VF)
Luminous Flux(ΦV)
Solderability
#1
#2
IF=700mA
-
<Initial value×0.7
Less than 95% solder coverage
16
NICHIA [ NICHIA CORPORATION ]
