欢迎访问ic37.com |
会员登录 免费注册
发布采购

NCSU033AT 参数 Datasheet PDF下载

NCSU033AT图片预览
型号: NCSU033AT
PDF下载: 下载PDF文件 查看货源
内容描述: 芯片类型UV LED [CHIP TYPE UV LED]
分类和应用:
文件页数/大小: 14 页 / 352 K
品牌: NICHIA [ NICHIA CORPORATION ]
 浏览型号NCSU033AT的Datasheet PDF文件第2页浏览型号NCSU033AT的Datasheet PDF文件第3页浏览型号NCSU033AT的Datasheet PDF文件第4页浏览型号NCSU033AT的Datasheet PDF文件第5页浏览型号NCSU033AT的Datasheet PDF文件第7页浏览型号NCSU033AT的Datasheet PDF文件第8页浏览型号NCSU033AT的Datasheet PDF文件第9页浏览型号NCSU033AT的Datasheet PDF文件第10页  
Nichia STSE-CC6130A
<Cat.No.061218>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180
~
200°C
120
~
150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile
1
. Temperature - profile
2
.
(N
2
reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<
1
: Lead Solder>
<
2
: Lead-free Solder>
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C
60sec.Max.
Above 200
°C
120sec.Max.
240°C Max.
10sec. Max.
1~ 5°C / sec.
1~ 5°C / sec.
Pre-heating
180 ~ 200°C
60sec.Max.
Above 220
°C
120sec.Max.
260°C Max.
10sec. Max.
2.5 ~ 5°C / sec.
[Recommended soldering pad design]
8 .4
4 .2
2 .8
Use the following conditions shown in the figure.
8 .4
7
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
(5) Cleaning
· Please do not use ultrasonic cleaning, which may reduce the reliability of the product.
-5-